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Hierarchical Dragonfly Wing： Microstructure-Biomechanical Behavior Relations

ISSN号：1672-6529
期刊名称：《仿生工程学报：英文版》
时间：0
分类：TN405[电子电信—微电子学与固体电子学] TG405[金属学及工艺—焊接]
作者机构：[1]Department of Engineering Mechanics, AML, Tsinghua University, Beijing 100084, China, [2]China Longyuan Power Group Corporation Limited, China Goudian, Beijing 100034, China, [3]CSIRO Earth Science and Resource Engineering, Clayton, VIC 3168, Australia, [4]Department of Mechanical System Engineering, Daiichi Institute of Technology, Kagoshima, 899-4395, Japan
相关基金：The authors would like to thank the projects （Nos. 11072124 and 11272173） supported by NSFC, National Basic Research Program of China （No. 2010CB631006） and by State Key Lab of Advanced Metals and Materials （No. 2010ZD- 04）.

作者： Yinglong Chen, Xishu Wang, Huaihui Ren, Hang Yin, Su Jia

关键词：疲劳裂纹扩展速率, 焊点, 扩展行为, 电子封装, 类型, 疲劳裂纹萌生寿命, 扫描电子显微镜, 加载, microcracking, fatigue, MEMS, experimental techniques, finite element method

中文摘要：

Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy(SEM) technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint.The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life(N50%) of a totally electronic board with 36 solder joints.

英文摘要：

Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy （SEM） technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life （N50%） of a totally electronic board with 36 solder joints.

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