中文摘要：

在BGA焊点空洞缺陷的X射线检测中,如何实现缺陷的定量分析是整个检测过程的关键所在。提出使用全局阈值分割算法提取焊点区域,使用动态阈值分割算法提取空洞区域的技术方案,通过数学形态学开闭运算来去除干扰,计算焊点区域和空洞区域的面积来实现空洞缺陷的定量分析。试验表明,两种分割算法相结合的技术方案合理可行,可快速准确计算焊球内空洞缺陷的面积比,实现焊接质量的定量分析。

英文摘要：

In X-ray inspection of the void defects in BGA solder balls, how to realize the quantitative analysis of defects is the key of the whole testing process. A global threshold segmentation algorithm was proposed to extract the solder ball area, a dynamic threshold segmentation algorithm was used to extract the void area, and the interference was removed by using mathematical morphology opening and closing operation.The quantitative analysis of void in solder balls was achieved by calculating the area of solder ball and voids. The experimental results show that the scheme with combination of the two methods is feasible and reasonable, and it can be used to quickly and accurately calculate the area ratio of the void defects in solder ball, and to realize the quantitative analysis of welding quality.