中文摘要：

为精确控制抛光阶段材料去除,实现光学元件的确定性抛光加工,在分析快速抛光原理和快速抛光材料去除机制基础上,从单颗磨粒受力和抛光垫峰点捕获的磨粒数出发,获得量化的单颗磨粒瞬时切除体积和抛光接触区参与有效磨粒数,从而建立一种光学元件快速抛光材料去除模型。研究结果表明：以材料去除量为实验对象,在不同抛光液、抛光垫和光学元件实验条件下,材料去除模型的理论预测结果与实验结果较为吻合,材料去除量误差可以控制在9%以内。验证了该模型对于光学元件快速抛光技术的适用性,从而可以确定性的控制快速抛光时间和效率。

英文摘要：

In order to accurately control the material removal in polishing stage,and achieve the deterministic polishing processing of toptical element,the quantitative mean volume removed by a single particles per unit time and the number of the active particles on the wafer-pad interface are obtained from the force applied on an abrasive particle and the number of all particles on the wafer-pad contact area. An optical element fast polishing material removal model is established based on the analysis of fast polishing principle and fast polishing material removal mechanism. Research shows that,under the experimental conditions of different polishing liquids,polishing pads and optical elements,the theoretically predicted results of the material removal model are well coincident with the experimental results,and the error of material removal can be controlled within 9%. The proposed model is verified to be suitable for the optical element fast polishing technology,thus deterministically controling the fast polishing time and efficiency.