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SnAgCu无铅钎料液体在非润湿线上的去润湿现象
  • 期刊名称:"作者: Wang, FX (Wang Fuxue); Zhang, L (Zhang Lei);
  • 时间:0
  • 分类:O351.2[理学—流体力学;理学—力学] TN405.93[电子电信—微电子学与固体电子学]
  • 作者机构:[1]Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences Shenyang 110016, China, [2]Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA, [3]Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
  • 相关基金:Acknowledgements This study was supported by the National Natural Science Foundation of China (No. 50501022) and the National Basic Research Program of China (No. 2004CB619306). The authors appreciate the helpful discussion with Prof. Z.G. Wang and experimental assistance of John P. Daghfal.
  • 相关项目:人造微纳结构上锡钎料的润湿特性
中文摘要:

Corresponding author. Prof., Ph.D.; Tel.: 4-217 333 9268; Fax: +217 333 2736; E-mail address: jkshang@illinois.edu (J.K. Shang).

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