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直流磁控溅射Au膜的微观应变研究
  • 期刊名称:分析测试学报, 28(2009)780
  • 时间:0
  • 分类:O766[理学—晶体学] TH456[机械工程—机械制造及自动化]
  • 作者机构:[1]滁州学院电子信息工程系,安徽滁州239000, [2]安徽大学物理与材料科学学院,安徽合肥230039
  • 相关基金:国家自然科学基金资助项目(50872001);教育部博士点专项基金资助项目(20060357003);安徽省高校青年教师科研资助研究项目(2008jq1114)
  • 相关项目:新型透反射式高电导Ag-ITO复合薄膜的制备、结构及光电性质研究
中文摘要:

采用直流磁控溅射技术在室温下制备了厚度为108.4和215.6nm的Au膜,膜厚由椭偏仪测定。利用常规CBD扫描模式对Au膜微结构进行分析,并采用剖面分析直接法测定Au膜的微观应变。X射线衍射(XRD)分析表明,Au膜在平行于基片表面沿〈111〉方向择优生长;衍射线剖面的宽化主要由品格畸变所致。厚度为215.6nmAu膜的微观应变量为0.065,比108.4nmAu膜(0.055)略大。

英文摘要:

Au films with two thicknesses of 108. 4 and 215. 6 nm were prepared by DC magnetron sputtering and analyzed by X-ray diffraction under the CBD scan mode. The microstrains of Au films were directly determined by X-ray diffraction spectra. The results showed that the films grew along the 〈 111 〉 direction parallel to the substrate surface. The breadths of diffraction profiles were mainly caused by lattice distortion. The microstrain of 215. 6 and 108. 4 nm Au film were O. 065 and 0. 055, respectively.

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