采用直流磁控溅射技术在室温下制备了厚度为108.4和215.6nm的Au膜,膜厚由椭偏仪测定。利用常规CBD扫描模式对Au膜微结构进行分析,并采用剖面分析直接法测定Au膜的微观应变。X射线衍射(XRD)分析表明,Au膜在平行于基片表面沿〈111〉方向择优生长;衍射线剖面的宽化主要由品格畸变所致。厚度为215.6nmAu膜的微观应变量为0.065,比108.4nmAu膜(0.055)略大。
Au films with two thicknesses of 108. 4 and 215. 6 nm were prepared by DC magnetron sputtering and analyzed by X-ray diffraction under the CBD scan mode. The microstrains of Au films were directly determined by X-ray diffraction spectra. The results showed that the films grew along the 〈 111 〉 direction parallel to the substrate surface. The breadths of diffraction profiles were mainly caused by lattice distortion. The microstrain of 215. 6 and 108. 4 nm Au film were O. 065 and 0. 055, respectively.