中文摘要：

介绍了一种从废旧电路板中分离提取铜并产出超细铜粉的新工艺。首先采用物理分选法分离出含铜的重密度组分,之后采用氧化氨浸—溶剂萃取工艺获得CuSO4溶液,最后以次亚磷酸钠为还原剂,以PVP为保护剂和分散剂,采用二次还原法,获得粒度1.5μm左右的抗氧化铜粉。浸出阶段优化条件为：温度35℃,时间2h,氨水和硫酸铵起始浓度均为2mol/L,空气流量8m3/h,固液质量体积比1∶10。铜萃取及反萃阶段优化条件为：萃取剂Lix84,萃取剂体积分数50%,相比1∶1,TBP浓度0.1mol/L,常温,以500次/min的速度震荡3min;反萃取剂硫酸,浓度0.2mol/L。在优化条件下,浸出、萃取及反萃取阶段的铜提取率分别为96.67%、98.87%及93.34%,效果良好。

英文摘要：

A new hydrometallurgical process combined with ammonia leaching, solvent extraction and secondary reduction for recovering copper from waste printed circuit boards（WPCBs）and producting ultrafine copper powder has been investigated. The results in the stages of copper oxidation leaching and solvent extraction indicated that 96.67% of copper could be recovered at temperature of 45 ℃for leaching 2 h using ammonium sulfate and ammonia concentration of 2 mol/L,and solid to liquid ratio of 1/10. The copper in leaching solution was solvent extracted for 3 rain using Lix84 dissolved in kerosene and tributyl phosphate（TBPY of 0.1 mol/L. Copper extraction and stripping efficiency were 98.87 % and 93.34%, respectively. Copper particle with well-dispersibility and diameter of 1.5/zm was preparated using the stripped solution.