阐述了半导体激光的特点及其在再制造领域中国内外应用现状、存在问题和发展趋势。半导体激光具有高效、轻量、金属高吸收率等特点,有利于开发节能降耗、高柔性的激光再制造装备与工艺,在再制造产业中有很大的发展潜力。目前,高功率半导体激光器已经逐步走入市场,半导体激光已经在国内外再制造产业中得到应用,以机器人作为执行机构的移动式半导体激光再制造装备与工艺也已经开始应用。半导体激光器的功率还有很大的提升空间,光学整形、光纤耦合等技术还在不断发展,与再制造工艺相关的机器人技术问题也在大力研究,多种材料的熔覆理论与工艺问题不断得到解决,过程检测控制理论技术也在继续攻关。未来的半导体激光再制造技术将突破工件的大小、形状、材质等多方面的制约,迈上一个新的台阶,在更深、更广的空间中应用和发展。
Remanufacturing technology is geared to resource saving and sustainable development.In this article, diode laser and its application in remanufacturing are introduced, and the obstacles against this application as well as the development trend of diode laser remanufacturing system are analyzed. Diode laser is fit to join into low-consumption and flexible laser remanufacturing system for its high electrical-to-optical conversion efficiency, small mass and body, and high absorption by metal. High-power diode laser units have been delivered to customer and are working for remanufacturing at home and abroad. Recently, the mobile diode laser remanufacturing equipment with a robot has also come into application. It is thought that the key to optical shaping and coupling will be found, and the obstacles against cladding with the appropriate materials on a variety of worn components will also be surmounted. Moreover, the robot technology relevant to diode laser remanufacturing is advancing, and the detection and control system for laser remanufacturing process is being developed. It is certain that components with any size, any shape and any material will be well remanufactured with diode laser in the further.