中文摘要：

采用浸泡模拟实验方法、电化学极化和电化学阻抗谱测试技术,研究了Cl~-浓度对SiC_P/Al复合材料电化学腐蚀行为的影响。结果表明：SiC_P/Al复合材料在Cl~-介质下钝化现象不明显,腐蚀过程主要为点蚀腐蚀。随Cl~-浓度增加,SiC_P/Al复合材料腐蚀速率增加,点蚀电位降低,且复合材料的腐蚀过程机制表现为由单纯电荷传递过程机制向电荷传递过程与腐蚀产物扩散共同作用的混合机制转变。电化学阻抗谱随Cl~-浓度增加呈现出2种类型：单一容抗弧类型、高频区容抗弧和低频区一条与实轴呈45°直线（经典Warburg阻抗）组合的复合类型。

英文摘要：

The effect of Cl~- concentration on the electrochemical corrosion behavior of SiC_P/Al composites was inverstigated by using immersion test,electrochemical polarization and electrochemical impedance spectroscopy test technique.The results show that passivation is not obvious of SiC_P/Al composites in Cl~- medium and the corrosion process is mainly pitting corrosion.With increasing of Cl~- concentration,the corrosion rate of SiC_P/Al composites increases,the pitting potential decreases,and the corrosion mechanism of the composites presents the characteristics of transfering from a unique charge transfer process mechanism to a mixed mechanism control of charge transfer process and corrosion production diffusion.Electrochemical impedance spectroscopy exhibits two type with increasing of Cl~- concentration：a unique capacitance arcs type and a mixed type including a capacitance arcs in high frequency region and a straight line with the real axis of 45°（classics Warburg resistance）in low frequency.