中文摘要：

采用二元熔盐氧化物Na2W04和W03，以脉冲电沉积的方法在占空比0．5、脉冲频率1000Hz、电沉积温度850℃的条件下，于热沉材料CuCrZr之上获得了金属钨镀层。讨论了电流密度对钨镀层微观结构、显微硬度、结合强度等性能的影响。当电流密度为20～30mA／cm2时，能够获得表面致密均匀的钨镀层。随着电流密度的增大，电流效率呈现先增大后下降的趋势，当电流密度为30mA／cm2时，电流效率达到最大值92．64％。

英文摘要：

Metallic tungsten coatings were obtained by pulsed electrodeposition on Cu-Cr-Zr alloy, a heat sink material, from binary molten salt NazWO4-WO3 at 850 ~C with duty cycle 0.5 and frequency 1 000 Hz. The effect of current density on microstructure, microhardness, and bonding strength were discussed. Uniform and compact tungsten coatings were obtained when the current density varied from 20 mA/cm2 to 30 mA/cm2. The current efficiency was increased initially and then decreased with the increasing of current density, and reached the maximum value （92.64%） at 30 mA/cm2.