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A novel approach for flip chip solder joint inspection based on pulsed phase thermography
  • ISSN号：0963-8695
  • 期刊名称：Ndt and E International
  • 时间：0
  • 页码：484-489
  • 相关项目：热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
作者： Lu, Xiangning|Liao, Guanglan|Zha, Zheyu|Xia, Qi|Shi, Tielin|
同期刊论文项目
热/声激励的高密度超细间距倒装焊缺陷诊断方法研究
期刊论文 23 会议论文 2 专利 4
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