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中文摘要：
制备了基于蓝宝石衬底的GaN基LED(C-LED)以及由激光剥离技术(LLO)制作的基于Cu衬底的相同电学结构的薄膜GaN基LED(LLO-LED)。通过研究发现,经过激光剥离过程后,器件的反向漏电流明显增加,其等效并联电阻下降了近两个数量级。通过对变温I-V曲线的分析,反向偏压下隧穿漏电机制的主导地位被发现并证实,而激光剥离前后样品腐蚀后的AFM照片显示缺陷密度没有明显改变。隧穿机制的增加是由于激光剥离过程激发了更多缺陷的隧穿活性。然而,蓝宝石衬底LED以及激光剥离薄膜Cu衬底LED的相似的理想因子和等效串联电阻说明激光剥离过程并未对器件的正向电学特性造成大的伤害。因此,高质量、高功率的激光剥离LED器件是可以期待的。对L-I曲线的分析显示,激光剥离过程引入了更多的非辐射复合中心,但激光剥离薄膜Cu衬底LED器件在大电流注入下仍然有着超出常规器件的表现。在300mA注入电流内,激光剥离薄膜Cu衬底LED展示的最大光功率是蓝宝石衬底GaN基LED的1.8倍,饱和电流超过2.5倍。这些结果显示,激光剥离Cu衬底LED仍然是高功率高亮LED的首选方案。
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