中文摘要：

采用偏光显微分析、X射线衍射分析和X射线光电子能谱分析等测试手段，对玻化砖和花岗石磨抛加工后材料表面的组成、结构和生成机理进行了研究。结果表明：在不同的加工条件下，材料被加工表面均存在平均厚度为60-80μm的表面损伤层，它由加工过程中微观裂纹形成的纳米尺寸的破碎矿物颗粒组成；磨粒和工件材料之间的机械作用引起了材料表面各元素电子结合能的增大，未发现加工表面生成过程中存在化学作用和产生新物质。

英文摘要：

Polarized-light microscopy, X--ray diffraction and X-ray photoelectron spectrum were adapted to analyze the makeup, structure and mechanism of the surface layer of ceramic tile and granite after grinding and polishing. It is founded that surface damaged layers of average thickness 60 -80μm are appeared on the surface regardless of the grinding conditions. It is composed of broken mineral grains caused by micro crack during machining whose grain sizes are in nanometer. The resuits also approve that mechanical function leads to the increase of element electron binding energy of elements on the surface. There is no chemical reaction during the course of grinding and no new substance is created in surface damaged layer.