汽车灯具如前照灯功率大,而大功率LED只有约30%的输入功率转化为光能,其余的则变成了热能,使LED芯片温度升高,而高温对芯片的工作性能影响极大,会导致芯片射出的光子减少,从而降低光输出;严重影响荧光粉的特性而引起波长漂移,使色温质量下降导致颜色不纯;加快芯片老化,缩短器件寿命。问题制约了发光二极管在汽车照明中的普及。该文从芯片的封装材料(基板)及多芯片的排列方式这两个方面入手,旨在找到最优散热方案,经过实验,最终得出最优方案,达到了课题的预期目标。
LED as a new generation of green environmental protection, low carbon, energy-saving solid-state lighting light source is more and more widely used in the field of lighting, but high power LED such as automobile headlamp has only about 30% of the input power to be transformed into light and the rest is changed into heat energy, which makes the LED chip temper- ature increased, influences the chip performance greatly, causes reduction of chip emission photons and light output, seriously affects the fluorescence powder characteristic caused by wavelength shift, results in a reduction of the color purity due to the decrease of color temperature quality, and finally accelerates the aging of the LED chip and shortens the service life of the whole device. This problem has restricted the popularization of LED in the automotive lighting. In this paper, the chip packaging material (substrate) and the arrangement of chips are researched to find out the optimal heat radiation scheme.