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A mesoscale simulation method for underfill encapsulation
  • 所属机构名称：华中科技大学
  • 会议名称：72nd Annual Technical Conference of the Society of Plastics Engineers: The Plastics Conference, ANTE
  • 时间：2014
  • 成果类型：会议
  • 相关项目：塑性加工工艺、模具与装备
同会议论文项目
塑性加工工艺、模具与装备
期刊论文 28 会议论文 8 获奖 8 专利 2 著作 1
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