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The Simulation Analysis of Temperature Effects on System Performance of Silicon Micro-Gyroscope
  • 所属机构名称：东南大学
  • 会议名称：3rd international conference on mechanical automation and materials engineering
  • 时间：2014.6.28
  • 成果类型：会议
  • 相关项目：基于芯片级温控的硅微陀螺仪温度误差校正理论与试验研究
作者： Yunpeng Deng|Bo Yang|Xingjun Wang|Bo Dai|
同会议论文项目
基于芯片级温控的硅微陀螺仪温度误差校正理论与试验研究
期刊论文 10 会议论文 9
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The Thermal Analysis and Simulation of On-chip Temperature Control Technology in the Micro-gyroscope
Structural Design and Simulation of a Fully Decoupled Dual-Mass Micro-Gyroscope
Structural Design and Simulation of a Fully Decoupled Dual-Mass Micro-Gyroscope
The Thermal Analysis and Simulation of On-chip Temperature Control Technology in the Micro-gyroscope
Structural Design and Simulation of a Fully Decoupled Dual-Mass Micro-Gyroscope
The Thermal Analysis and Simulation of On-chip Temperature Control Technology in the Micro-gyroscope
Structural Design and Simulation of a Fully Decoupled Dual-Mass Micro-Gyroscope
The Thermal Analysis and Simulation of On-chip Temperature Control Technology in the Micro-gyroscope