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The numerical analysis on the weld-bonded joints with bi-adhesive
  • 所属机构名称：三峡大学
  • 会议名称：2010 International Conference on Computer Modeling and Simulation, ICCMS 2010
  • 成果类型：会议
  • 相关项目：超常温湿度作用后金属胶接结构的抗冲击性能
作者： You, Min1, 2|Yan, Jialing1|Zheng, Xiaoling1|Zhu, Dingfeng1|Li, Jianli2|Hu, Jingrong1|
同会议论文项目
超常温湿度作用后金属胶接结构的抗冲击性能
期刊论文 12 会议论文 24
同项目会议论文
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3-D Finite Element Analysis of Bonded Joints under Impact Loading
Effect of adherend thickness on stress distributed in weld-bonded aluminum joints
Effect of temperature on the thermal stress in the single lap joint
Effect of alkali on the impact toughness of adhesively bonded joints
The Effect of Fillet Geometry on Stress in Weld-bonded Joints
Effect of preformed angle on stress distributed in weld-bonded aluminum single lap joints
Numerical analysis of adhesive thickness on butt-joints under impact
The Effect of Adhesive for Fillet on Stress in Weld-Bonded Joints
Effect of constraints in cooling process on the residual stress in the adhesively bonded single lap
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Effect of shock temperature on the impact toughness of butt-joint