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Effect of constraints in cooling process on the residual stress in the adhesively bonded single lap
  • 所属机构名称：三峡大学
  • 会议名称：International Conference on Frontiers of Manufacturing Science and Measuring Technology (ICFMM2011
  • 成果类型：会议
  • 相关项目：超常温湿度作用后金属胶接结构的抗冲击性能
作者： You, Min|Chen, Cunjun|Zhang, Jiangcheng|Hu, Jingrong|Wu, Ling|
同会议论文项目
超常温湿度作用后金属胶接结构的抗冲击性能
期刊论文 12 会议论文 24
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