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Model-based dynamic characteristics investigation of ultrasonic transducers for MEMS packaging
  • 所属机构名称：天津大学
  • 成果类型：会议
  • 相关项目：面向IC封装的高速精密定位系统及关键技术
同会议论文项目
面向IC封装的高速精密定位系统及关键技术
期刊论文 13 会议论文 8
同项目会议论文
Design Methodology of High Frequency Ultrasonic Transducer for Wire Bonding
Optimization design of high frequency piezoelectric ultrasonic transducer for IC packaging
Design and Simulation of the Positioning System Using Computer Vision for IC Packaging
Dynamic design of high speed precision positioning system
Calibration of computer vision positioning system for MEMS wire bonder
The structure design and control of precision positioning system driven by rotary VCA
The design of new ultrasonic transducers for wire bonding devices