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Modeling of adhesive layers of laminated plates in delamination simulation
  • 所属机构名称：天津大学
  • 会议名称：17th International Conference on Composite Materials, ICCM-17
  • 成果类型：会议
  • 会场：爱丁堡
  • 相关项目：低速冲击下复合材料层合板逐渐损伤分析的高效仿真模型
作者： Shi, G.|Zhang, H.|
同会议论文项目
低速冲击下复合材料层合板逐渐损伤分析的高效仿真模型
期刊论文 7 会议论文 8
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