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Numerical Investigations on the Grinding Forces in Ultrasonic Assisted Grinding of SiC Ceramics by U
  • 所属机构名称：北京理工大学
  • 时间：2014.9.26
  • 成果类型：会议
  • 相关项目：光学晶体材料的超声振动空间螺旋线磨削方法及其机理研究
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光学晶体材料的超声振动空间螺旋线磨削方法及其机理研究
期刊论文 11 会议论文 9
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