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The Design and Fabrication of RF Band Pass Filter by LTCC Technology
  • 所属机构名称：电子科技大学
  • 会议名称：International Conference on Electronic Packaging Technology and High Density Packaging
  • 成果类型：会议
  • 会场：Shanghai, PEOPLES R CHINA
  • 相关项目：信息薄膜与LTCC集成器件
作者： Zhang, Huaiwu|Yang, Zongbao|Liu, Yingli|Bian, Lifei|Li, Yuanxun|Lu, Dafu|
同会议论文项目
信息薄膜与LTCC集成器件
期刊论文 200 会议论文 42 获奖 6 专利 81
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