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Analysis and Validation of Hybrid Model for Signal Via Structures in Complex Conditions
  • 所属机构名称：电子科技大学
  • 会议名称：2015 IEEE 6th International Symposium on Microwave,Antenna, Propagation, and EMC Technologies
  • 时间：2015.10.28
  • 成果类型：会议
  • 相关项目：复杂条件下微波多层电路互连过孔结构最优设计及测试研究
同会议论文项目
复杂条件下微波多层电路互连过孔结构最优设计及测试研究
期刊论文 3 会议论文 7
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