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Study of the Thermal Field and Thermal Stress Field of Typical BGA Packaging by Numerical Simulation
  • 所属机构名称：北京科技大学
  • 会议名称：ICEPT-HDP2014-- International Confernence on Electronic Packaging Technology & High Density Pack
  • 时间：2014.8.12
  • 成果类型：会议
  • 相关项目：半固态灵活触变挤压成形机理及流动前沿质量控制技术研究
同会议论文项目
半固态灵活触变挤压成形机理及流动前沿质量控制技术研究
期刊论文 19 会议论文 10 获奖 2 著作 1
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