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Research on Electroplating of SiC/Al Electronic Packaging Composites
  • 所属机构名称：北京科技大学
  • 会议名称：ICEPT-HDP2012
  • 时间：2012.8.18
  • 成果类型：会议
  • 相关项目：半固态灵活触变挤压成形机理及流动前沿质量控制技术研究
作者： Kai-kun WANG|Jian-quan DU|Yang LEI|
同会议论文项目
半固态灵活触变挤压成形机理及流动前沿质量控制技术研究
期刊论文 19 会议论文 10 获奖 2 著作 1
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