位置：成果数据库 > 会议 > 会议详情页
Material Removal and Surface Modification in Chemical Mechanical Polishing of GaAs Wafer
  • 所属机构名称：清华大学
  • 成果类型：会议
  • 相关项目：类球形有机大分子抛光液设计及其原子级抛光机理
同会议论文项目
类球形有机大分子抛光液设计及其原子级抛光机理
期刊论文 22 会议论文 19 获奖 2
同项目会议论文
Numerical Analysis on dynamic characteristics of flying magnetic head with ultra thin spacing.
Numerical Analysis on Dynamic Characteristics of Flying Magnetic Head under Ultra Thin Spacing
Analysis on Dynamic Lubrication Characteristics of Gas film in hard disk system
Effect of the stability parameters of nano-SiO2 slurries on Chemical-mechanical polishing (CMP) of s
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP)
半导体GaAs晶片表面化学机械抛光研究
不同络合剂对硬盘基片抛光液抛光性能的影响
石英晶片表面化学机械抛光试验研究
LED蓝宝石衬底晶片化学机械抛光液及其抛光性能研究
Numerical Analysis on Lubrication Characteristics of Nanometer Gas Film in Hard Disk Drive
Inertial force measurement of an actuator arm of a hard disk drive in free oscillation by numerical
Design considerations for reducing shock responses of a micro-drive.
Numerical Analysis on Dynamic Characteristics of Flying Magnetic head with Ultra Thin spacing.
Effect of Ingredients in Slurry Containing Alumina on Chemical Mechanical Polishing of Hard Disc Sub
Slurry parameters effect on chemical-mechanical planarisation (CMP) of deposited silver (Ag) on chip
硅烷偶联剂改性二氧化硅颗粒及其超精抛光性能研究
离子交换法提高硅晶片抛光液去除速率试验研究
抛光液特性对计算机硬盘盘基片表面抛光性能的影响