位置：成果数据库 > 会议 > 会议详情页
Delamination Growth of Foam Core Composite Sandwich Plate Under Harmonic Dynamic Load
  • 所属机构名称：大连理工大学
  • 会议名称：2nd International Symposium on Intelligent Information Technology Application
  • 成果类型：会议
  • 会场：Shanghai, PEOPLES R CHINA
  • 相关项目：夹芯复合材料界面裂纹动态起裂和扩展机理的跨尺度研究
作者： Sun Shiyong|Chen Haoran|Bai Ruixiang|
同会议论文项目
夹芯复合材料界面裂纹动态起裂和扩展机理的跨尺度研究
期刊论文 17 会议论文 14
同项目会议论文
The Dynamic Stress Intensity Factor Analysis of Adhesive Bonded Material Interface with Damage under
Nonlinear Dynamic Stability Analysis for Piezoelectric Composite Laminates with Debonded Interfaces
T he Effect of Interface Debonding between Piezoelectric Layers and Laminates on Nonlinear Dynamic S
Application of continuum constitutive model for fracture analysis of metallic foam with element-free
Three dimensional simulation for dynamic failure of aluminum foam sandwich structure under ballistic
Stochastic Elasto-plastic Fracture Analysis of Aluminum Foam Using Cohesive Zone Model
Interfacial Delamination Growth in Visco-Elastic Adhesive Layer of Foam Core Sandwich Beams
Three Dimensional Simulation for Dynamic Failure of Aluminum Foam Sandwich Structure under Ballistic
The effect of Viscoelastic Interface Crack upon Dynamic Fracture behavior of Foam Core Composite San
含粘弹性胶层的泡沫夹芯复合材料界面断裂分析
考虑随机分布的泡沫铝非线性断裂分析
夹芯复合材料粘弹性界面裂纹的动态断裂分析
The Dynamic Fracture Analysis of Adhesively Bonded Material under Normal Loading