中文摘要：

为了减少锗组件加工时易发生断裂破坏和加工表面质量不均一问题,从单晶锗结构的各向异性特征出发,研究了单晶锗材料解理面和滑移面上的应力变化;给出晶体取向对切屑脆-韧去除方式影响程度的判据;建立了单晶锗任意晶面的解理面和滑移面上应力计算模型;分析了单晶锗车削表面粗糙度以及切削力的各向异性分布规律。并对典型晶面及任意晶面的切屑脆-韧去除方式和晶向之间关系进行了计算。通过切削试验,验证了模型和判据的正确性。

英文摘要：

In order to reduce the fracture damage and the not uniform quality of the machined surface in cutting of germanium element,according to the anisotropic characteristics of germanium single crystal structure,stress the change of the cleavage plane and slip surface of single crystal germanium were studied. The criterion of the degree of the crystal orientation influencing the brittle-ductile removal mode of chip was given. A stress calculation model for the cleavage plane and slip plane of single-crystal germanium arbitrary crystal plane was established,and anisotropy distribution law of machined surface roughness of single-crystal germanium was analyzed. The relationship between the brittle-ductile removal mode of chip and the crystal orientation of the arbitrary crystal plane and typical crystal plane was calculated. The correctness and effectiveness of the criterion and model were verified via ultra precision cutting experiment.