中文摘要：

使用一种新型添加剂—碱性黄（Basic Yellow,BY）作为整平剂进行微盲孔铜电镀填充。通过微孔填充组织观察以及旋转圆盘电极电化学测试,考察该整平剂的微孔填充性能,分析该整平剂与抑制剂、加速剂之间的协同和竞争吸附行为,揭示其在微孔填充中的作用机理。结果表明：BY含量对微孔填充性能具有重要影响,当BY浓度大于5 ppm时,BY-EPE电镀液体系可以实现自底向上沉积方式,达到无孔洞化填充的效果;适量氯离子可协同BY在孔口处的抑制作用,有利于形成超等形沉积方式;当SPS含量低于1ppm时,有利于形成超等形沉积,随着SPS含量增加,沉积模式转变为等形模式。BY与抑制剂EPE可形成复合性抑制剂,该抑制剂对镀液对流条件具有更强的敏感性,有利于在孔壁进行选择性吸附,从而形成自底向上沉积模式;同时,氯离子可协同该整平剂在高对流条件下的抑制作用;SPS的吸附竞争力弱于BY,但强于BY-EPE复合体,因此,在EPEBY-SPS镀液体系中,过量的SPS添加可以减少BY-EPE抑制剂的吸附,不利于形成超等形沉积模式。

英文摘要：

In this paper, a new additive of Basic Yellow （BY） was used as leveler for microvia filling. Through the observation of Cu filled microvia after electroplating and the electrochemical tests using rotation disk electrode, filling mechanism was revealed by examining the filling performance for microvia using BY- contained electrolyte and analyzing the synergistic operation and competitive adsorption between the BY, suppressor and accelerator. The results show that the concentration of BY has an important effect on microvia filling. When the concentration of BY is more than 5 ppm, a bottom-up filling can be realized in the BY-EPE electrolyte for void-free filling. The amount of chloride ion enhances the suppressing effect of BY at the openings of microvias, which is favorable for a microvia superfilling mode. When the concentration of SPS is less than 1 ppm, a superconfromal filling mode can be realized. But, with the increase of SPS, the deposition mode is changed into a conformal filling. It was thought that the BY can interact with suppressor to form a composite suppressor. The composite suppressor is more sensitive to the convection, which easily resulted in a selective adsorption within the microvia and then obtained a bottom-up filling mode. Meanwhile, the chloride ion can enhance the suppressing effect of BY in a high convection condition. Since the competitive adsorption of SPS is weaker than BY but stronger than BY-EPE,in EPE-BY-SPS electrolyte excessive SPS can reduce the adsorption of BY-EPE and is detrimental to the formation of superfilling mode.