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Influences of compatibilization and compounding process on electrical conduction and thermal stabili
  • ISSN号：0959-8103
  • 期刊名称：Polymer International
  • 时间：2013
  • 页码：238-245
  • 相关项目：SiO2@PS核-壳复合粒子填充PS的熔体流变行为
作者： Xu, Chunfeng1|Tan, Yeqiang1|Song, Yihu1, 2|Zheng, Qiang1, 2|
同期刊论文项目
SiO2@PS核-壳复合粒子填充PS的熔体流变行为
期刊论文 23 会议论文 8
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