位置：成果数据库 > 期刊 > 期刊详情页
Low thermal expansion behavior and electrical conductivity of Mn 3(Cu0.5SixGe0.5-x)N at low temperat
  • ISSN号：1293-2558
  • 期刊名称：Solid State Sciences
  • 时间：0
  • 页码：1977-1980
  • 相关项目：掺杂锰氮化物宽温区负热膨胀行为的机理研究
作者： Huang, Rongjin|Wu, Zhixiong|Chu, Xinxin|Yang, Huihui|Chen, Zhen|Li, Laifeng|
同期刊论文项目
掺杂锰氮化物宽温区负热膨胀行为的机理研究
期刊论文 13
同项目期刊论文
Negative thermal expansion and nearly zero temperature coefficient of resistivity in anti-perovskite
Spin-glass behavior in the antiperovskite manganese nitride Mn 3CuN codoped with Ge and Si
Mechanical and transport properties of low-temperature negative thermal expansion material Mn3CuN co
Low thermal expansion behavior and transport properties of Ni and Ge co-doped manganese nitride mate
Mechanical and thermal expansion properties of glass fibers reinforced PEEK composites at cryogenic
The cryogenic thermal expansion and mechanical properties of plasma modified ZrW2O8 reinforced epoxy
Preparation and thermal properties of epoxy composites filled with negative thermal expansion nanopa
Bi_2Te_3合金低温热电性能及冷能发电研究
Mn3（Cu0.6Si0．15Ge0．25）N／Ag复合材料的负热膨胀与物理性能