为满足面积阵列封装对所需焊球越来越高的要求,提出了利用气动膜片式微滴喷射原理制作焊球的新方法。介绍了该方法的基本原理及所采用的实验装置,使用由自制电火花微孔加工机床加工的直径50μm不锈钢喷嘴,成功实现了直径100μm以下焊球的制作,研究了主要控制参数对焊球直径的影响。结果表明,气动膜片式微滴喷射方法制作的焊球直径精确、表面闪亮、球形完美,填补了国内直径100μm以下超精密微焊球制作技术的空白。
Aimed at high uniform ultra-small solder balls requirement in area array package,a novel fabrication method was developed based on pneumatic-diaphragm droplet jetting.The principle and self-developed equipment of this method were introduced in this paper.Solder balls with diameter less than 100μm were fabricated with a stainless steel nozzle of 50μm in diameter.Meanwhile main control parameters were studied to investigate their effects on the diameter of solder balls.The results prove that pneumatic-diaphragm droplet jetting method can fabricate solder balls with highly uniform diameter less than 100μm,good exterior quality and roundness,which fills up the blank of domestic solder ball fabricating technology.