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Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect due to Thermal Load
  • 期刊名称：Journal of Electronic Packaging, Transactions of t
  • 时间：0
  • 页码：0210101-0210107
  • 语言：英文
  • 相关项目：微系统连接界面分层失效的实验和微极模型研究
作者： Zhang, Yan|Larsson, Ragnar|Liu, Johan|
同期刊论文项目
微系统连接界面分层失效的实验和微极模型研究
期刊论文 9 会议论文 17
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