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Study on the Bimodal Filler Influence on the Effective Thermal Conductivity of Thermal Conductive Ad
ISSN号:0946-7076
期刊名称:Microsystem Technologies
时间:0
页码:93-99
语言:英文
相关项目:微系统连接界面分层失效的实验和微极模型研究
作者:
Yue, Cong|Fan, Jing-Yu|Liu, Johan|Zhang, Yan|Inoue, Masahiro|
同期刊论文项目
微系统连接界面分层失效的实验和微极模型研究
期刊论文 9
会议论文 17
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Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect due to Thermal Load
Micropolar Interface Model of Thin-Layered Interconnection Components with Heterogeneous Internal Mi
Numerical investigation on thermal properties of micro-pin-fin cooler
Micropolar interface model of thin-layered interconnection components with heterogeneous internal microstructures