中文摘要：

在三维系统封装技术中，金属热压键合是实现多层芯片堆叠和垂直互连的关键技术。为了解决热压键合产生的高温带来的不利影响，工业界和各大科研机构相继开发出了多种低温键合技术。综述了多种不同的低温金属键合技术（主要是Cu-Cu键合），重点阐述了国内外低温金属键合技术的最新研究进展及成果，并对不同低温金属键合技术的优缺点进行了分析和比较。

英文摘要：

Metal thermo compression bonding approach is the key technology for the realization of multi-chip stacking and vertical interconnection in 3D system packaging. In order to eliminate the adverse impact of high temperature, various low temperature bonding methods are developed by the world-wide companies and research institutes. Different low temperature metal bonding approaches （mainly Cu-Cu bonding） are reviewed and introduced, the latest developments and results are focused on. The merits and drawbacks of various low temperature bonding technologies are analyzed.