中文摘要：

采用离心力使硅片直角边与模具凹槽直角边贴紧对准的思想,提出了一种用于三维系统封装的多芯片对准技术.基于该技术原理制作了对准装置,并实现了多芯片一次性对准键合（6层芯片）.具体过程包括：加工带方形凹槽的模具;将芯片切割为形状一致的方形,并保证边缘整齐;将芯片置入凹槽并旋转模具,对准后停止旋转并夹紧固定堆叠芯片;将固定后的芯片转移至键合腔内实现键合,试验测试键合后对准误差为4μm.具体分析了影响多层芯片对准精度的因素,并提出了优化方案,论证了离心对准技术的可行性.

英文摘要：

A centrifugalization alignment technology for multichip bonding in 3Dpackaging was proposed.The alignment device was made on the basis of this principle which realize multiple alignment bonging at the same time（6chips）.The specific process includes cutting chips into the same square with neatly edges;fabricating a mould with 4rectangular grooves;putting the chips into the grooves and rotating the mould until all the chips alignment;fixing the chips stack and transfer them to the bonding chamber in the bonder.The alignment principles were discussed in detail and the measured alignment accuracy was about 4μm.The factors that affect the accuracy of this method and the device were analyzed and some realizable optimization schemes were put forward to solve these problems,which demonstrated the feasibility of centrifugalization alignment technology.