中文摘要：

采用高能量飞秒激光脉冲对硅片和载玻片的未抛光表面进行了烧蚀，对烧蚀后样品的表面形貌和纳米力学性能进行了检测。用显微镜对烧蚀后样品的表面形貌进行检测，硅片烧蚀后正面形貌随位置不同发生渐变，而烧蚀后玻璃正面烧蚀区与未烧蚀区有明显界限。用原子力显微镜对烧蚀后样品的预抛光背面进行了检测，发现硅片烧蚀前后背面形貌未发生显著变化；而玻璃烧蚀前后背面形貌发生了明显改变，且烧蚀区与未烧蚀区的背面形貌有较为明显的界限。利用原位纳米力学测量仪对样品抛光背面的纳米力学性能进行了测量，发现硅片背面纳米力学性能有与正面烧蚀区渐变形貌相对应的规律性变化，而玻璃烧蚀前后背面的纳米力学性能则无显著变化。样品表面微观形貌和纳米力学性能的规律性变化在一定程度上反映了高能量飞秒激光脉冲在样品背面产生附带损伤的分布情况。

英文摘要：

High-energy laser pulses are utilized to ablate the unpolished surface of silicon wafer and slide glass and morphology and nanomechanical properties of the sample surface are characterized. The morphology on the ablated front surface is measured by a microscope. The morphology on the front surface of silicon wafer varies with positions, yet there is a distinct boundary between the ablated and unablated areas on the front surface of slide glass. The morphology on the smooth back surface is characterized by AFM. After irradiation, there are no prominent changes in morphology on the back surface of silicon wafer. While, the morphology on the back surface of slide glass is markedly changed by laser pulses, and there is also a clear boundary between the back of the ablated zone and the back of the unablated zone. Nanomechanical properties on the back surface of the two samples are measured by a commercial nanomechanical test system. Regular variations in nanomechanical properties corresponding to that in morphologies on the ablated front surface occur on the back surface of silicon wafer. Yet such regular variations do not appear on the back surface of slide glass. The regular changes in morphology and nanomechanical properties, to some extent, show the distribution of collateral damages, which is induced by the ill effects during high-energy femtosecond laser ablation,