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Reducing the thermal conductivity of silicon by nanostructure patterning
  • ISSN号：0947-8396
  • 期刊名称：Applied Physics A-Materials Science & Processi
  • 时间：2013.1
  • 页码：93-98
  • 相关项目：Bi基低维热电材料的结构设计与性能优化
作者： X. J. Tan|H. Y. Lv|J. Shi|X. F. Tang|
同期刊论文项目
Bi基低维热电材料的结构设计与性能优化
期刊论文 22
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