中文摘要：

采用粉末冶金法制备了不同体积分数的纳米MgO颗粒增强铜基复合材料,测定了MgO/Cu复合材料的密度、硬度和电导率,并进行了微观组织观察。结果表明,随着MgO颗粒含量的增加,MgO/Cu复合材料的密度和电导率降低,硬度先升高后降低,当MgO体积分数达到2.5%时,综合性能最好。微观组织观察表明,热挤压后,增强相颗粒弥散分布在铜基体上;随着增强相体积分数的增加,颗粒出现团聚并聚集在铜基体晶界处。

英文摘要：

The varied volumetric fraction nano-MgO particle reinforced copper matrix composites（MgO/Cu composites） were prepared by powder metallurgy technology. The hardness,density and electric conductivity of the MgO/Cu composites were examined,and its microstructure was observed. The results indicate that,with increasing in MgO particle content,density and electric conductivity of the composites are decreased,however,hardness is firstly increased and then decreased. The desirable comprehensive properties of the composites can be obtained with 2.5% MgO particle. Reinforcement is uniformly and dispersedly distributed into the copper matrix after hot extrusion. With increasing in volumetric fraction of reinforcement,nano-particles appear together and gather in grain boundary of copper matrix.