中文摘要：

将纳米级Al2O3以体积分数为1％的配比与微米级Cu粉混合均匀后，采用放电等离子烧结（SPS）法，分别在750、800和850℃进行烧结制备复合材料；将同样的混合粉末采用冷压烧结制备复合材料作为对比。分别测试材料的密度、硬度、导电率，并进行SEM扫描电镜分析。结果表明：在所选择试验参数下，烧结温度为800℃SPS烧结试样具有最高的相对密度，达到99．17％，硬度与导电率也最高；与冷压烧结制备的材料相比，SPS法制备的试样硬度和导电率更高；SPS烧结试样晶粒均匀细小，并出现了孪晶。

英文摘要：

Al2O3/Cu composite with AI203 volume fraction content of 1% was prepared by spark plasma sintering （SPS）. The sintering temperatures were 750℃, 800℃ and 850℃ respectively. A1203/Cu composite by cold sintering was prepared as a comparison. The performance of the composite were tested, and the mierostructure were observed by a scanning electron microscope. Experimental results show that the density of composite prepared by spark plasma sintering temperature of 800℃ is the highest, up to 99.17%. The hardness and electric conductivity of composite prepared by SPS temperature of 800℃ reach the maximum. The hardness and electric conductivity of the composite prepared by SPS are higher than the composite prepared by cold sintering. The mierostrueture observation show that the grains are uniform, and twinning is observed.