中文摘要：

采用波长漂移法对基于C-mount封装类型的不同尺寸芯片的热阻进行测量，得到了使热阻最小的最佳芯片尺寸和铟焊料厚度。测量结果表明，在铟焊料厚度为10Ixm、输出功率为2W、条宽为200μm、腔长为2000μm时，激光器芯片的热阻最小值为2．01℃／w。在铟焊料厚度为5Ixm和10μm两种条件下，对腔长为2000斗m的不同条宽的激光器芯片的热阻进行了测量，在铟焊料厚度为5μm时，激光器芯片的热阻由原来的2．01℃／W降到了1．85℃／W。

英文摘要：

Thermal-resistor of different chips based on C-mount package have been measured with the method of wavelength shift in this paper. Through the thermal-resistance measurement, we can get the best size of chip and the thickness of In solder to make the smallest thermal-resistance. The results show that when the thickness of In solder is 10μm, the output power is 2 W, the bar width is 200 μm, the cavity length is 2 000μm and the minimum thermal-resistor of the chip is 2.01 ℃/W. The thermal-resistors with carvity length of 2 000 μs have been measured when the In solder thickness is 5 μm and 10 μm. The results show that the thermalresistor dropes from 2.01 ℃/W to 1.85 ℃/W for the 5 μm In solider.