中文摘要：

在含Ni2＋的2AlCl3/Et3NHCl离子液体中的铜电极上通过恒电位电沉积制备出金属Ni和Ni-Al合金.采用循环伏安和计时电流方法,揭示铜电极上沉积金属Ni的成核机理,研究了电沉积Ni-Al合金的机理,以及恒电位沉积Ni-Al合金工艺条件对沉积Ni-Al合金表面形貌和电流效率的影响.结果表明：在铜电极上电沉积金属Ni的成核机理为受扩散控制的三维瞬时成核过程.在电量≥3.0C时,电沉积Ni-Al合金的组成基本不再变化.Ni-Al合金的电沉积机理为,Ni的电沉积受扩散控制,同时进行Al的欠电位沉积,在Ni-Al合金电沉积过程中某些Ni-Al合金相的沉积可能受动力学限制而使Ni-Al合金的组成偏离热力学预测结果.在电沉积Ni-Al合金的沉积电流小且平稳,电沉积速率慢条件下,Ni-Al合金表面形貌致密均一,反之就会出现瘤节.电沉积Ni-Al合金的电流效率〉90%.电沉积物的组成接近于Ni3Al合金.

英文摘要：

Nickel and nickel-aluminum alloy were successfully electrodeposited on Cu electrodes from 2：1 molar ratio aluminum chloride （AlCl3）/triethylamine hydrochloride （Et3NHCl） ionic liquids containing Ni2＋ by constant potential electrolysis.The nucleation mechanism of nickel electrodeposition on Cu was investigated by cyclic voltammograms and chronoamperometry.The mechanism and the influence of experimental conditions on the current efficiency and the surface morphology of nickel-aluminum alloy electrodeposition on Cu electrodes were studied.The electrodeposition of nickel on Cu electrodes was controlled by three-dimensional instantaneous nucleation with diffusion-controlled growth.The Ni-Al alloy composition did not become independent of the deposition charge until at least 3.0 C had been accumulated.The mechanism of Ni-Al alloy formation appears to involve the underpotential deposition of aluminum on the developing nickel deposit and alloy formation must be kinetically hindered because the aluminum content is always less than that predicted from theoretical considerations.The Ni-Al alloy that was obtained on the Cu electrode was dense,continuous,and well adherent when the deposition current was small and stationary.If these conditions were not met,a nodule surface morphology appeared.The current efficiency of the Ni-Al alloy electrodeposition was greater than 90% and the deposition composition was close to that of the Ni3Al alloy.