中文摘要：

AgCu、AgSn、AgSnCu、Ag2O、Ag粉经研磨、烧结和复压复烧等实验过程制备出AgSnO2CuO复合材料,并研究了该材料的密度、硬度、电阻率以及显微组织。结果表明,以AgCu、AgSn为原料的复合材料组织分布比以AgSnCu为合金原料的均匀,并且弥散程度较高。此外,压坯密度和烧结后样品密度变化不大,且复压复烧可有效提高样品的密度,复压复烧后样品的电阻率比烧结态的低,而硬度有所升高。

英文摘要：

AgSnO2CuO composite was prepared by the process of grinding, sintering, repressing and resintering on AgCu, AgSn, AgSnCu, Ag20 and Ag powder. The density, hardness, electrical resistivity and microstructure of the samples were studied. The microstructure distribution of the composite prepared taking AgCu and AgSn as raw material is more uniform than that of AgSnCu, and the dispersion degree is higher. In addition, the density of the blank and the density of the sample after sintering change a little. The repressing and resistering can effectively improve the density of the sample. The electrical resistivity of the samples after repressing and resistering is lower than that of the sintered state, but the hardness increases.