研究了以E-51改性TDE-85环氧树脂/2-乙基-4-甲基咪唑为基体的RTM用树脂体系,通过对该环氧树脂体系的化学流变特性研究,建立了双阿累尼乌斯流变模型,并采用DSC研究确定该树脂体系的固化工艺。结果表明,模型对树脂粘度的模拟结果与实验结果具有良好的一致性,所建立的粘度模型可有效模拟该树脂体系在不同工艺条件下的粘度行为,准确预报树脂体系的低粘度工艺窗口。浇铸体的力学性能测试结果表明,弯曲强度为82.31 MPa,弯曲模量为3.37 GPa。
A resin system suitable for resin transfer molding(RTM) was studied,which was prepared by using E-51 modified TDE-85 epoxy/2-ethyl-4-methyl imidazole system as matrix.A chemorheological model of the resin system was derived based on the dual-Arrhenius equation.The curing process of resin system was determined by means of DSC.The results show that simulated values of the established model are in good agreement with the experimental results.The established model can effectively simulate viscosity behavior of the resin system under different process conditions and accurately predict low viscosity process window of the resin system.The mechanical property test results of casting system show that flexural strength is up to 82.31 MPa and the flexural modulus reaches 3.37 GPa respectively.