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Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling
  • 期刊名称：Journal of Alloys and Compounds
  • 时间：2013.7.7
  • 页码：110-117
  • 相关项目：金属构件疲劳损伤愈合与微裂纹修复方法的研究
作者： H Xiao, X.Y Li, Y Hu, F Guo, Y.W Shi|
同期刊论文项目
金属构件疲劳损伤愈合与微裂纹修复方法的研究
期刊论文 29 会议论文 6 专利 6
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