中文摘要：

利用常温下的Cu-H2O、Mo-H2O和Ni-H2O的E-pH图,分析电镀Cu-Mo-Ni合金材料的可行性.结果表明：在一定条件下,Cu、Ni可以在热力学稳定区域发生共沉积.Mo在含MoO42-或CC＋、MoO42-水溶液中不能析出.但在Ni2＋诱导下,Mo能以Ni-Mo合金形式析出.因此,电镀法制备Cu-Mo-Ni合金是可能的.

英文摘要：

The feasibility of electroplating Cu-Mo-Ni alloy based on E-pH diagrams of Cu-H2O,Mo-H2O and Ni-H2O obtained at normal temperature was analyzed.Results showed that codeposition of Cu and Ni can be realized in thermodynamical stable region under certain conditions.In addition,Mo element can＇t precipitate from the aqueous solution containing MoO42-or Cu2＋,MoO42-,while it can precipitate in the form of Ni-Mo alloy with the help of Ni2＋.Therefore,electroplating was a feasible method to prepare Cu-Mo-Ni alloy.