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中文摘要：
综述了电镀法制备银基、铜基电接触材料的研究现状和发展趋势.采用电镀工艺制备多元微合金化铜合金镀层,将是今后铜基电接触材料研究的重要方向.
英文摘要：
The research status and development tendency of silver-based electrical contact material and copper-based electrical contact material prepared by electroplating were overviewed. Meanwhile, it was pointed out that preparation of multielement copper-based alloy coating by electroplating process will become an important research direction.
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