中文摘要：

以端乙烯基硅油为基胶、含氢硅油为交联剂、r-甲基丙烯酰氧基丙基三甲氧基硅烷（KH-570）为表面处理剂、A1（OH），或AI（OH）3／铂络合物为阻燃剂，制备阻燃型有机硅电子灌司胶。研究结果表明：对AI（OH），表面进行处理、降低其粒径、增加其含量、A1（OH）3／铂络合物并用等均有利于提升灌封胶的阻燃性能；当W（KH-570）=0．5％[相对于A1（OH）3质量而言]、A1（OH）。的平均粒径为2．6μm、m（5．0μmA1203）：m2．6μmA1（OH），]=160：40和W（铂络合物）=0．002％（相对于基胶质量而言）时，可制得阻燃性优异的有机硅电子灌封胶。

英文摘要：

With a vinyl-terminal silicon oil as matrix ,a silicon oil containing hydrogen as cross hnker, a r-methacryloxypropyltrimethoxysilane （KH-570） as surface treatment agent, A1 （ OH ） 3 or A1 （OH） 3/platinum complex compound as flame retardants,an organosilicon electronic-pouring sealant with flame-retardant was prepared. The research results showed that the flame-retardant of pouring sealant could all be enhanced by following methods such as surface treatment of Al（OH）3,reducing its particle sizes and increasing its contents, using Al（OH）3/platinum complex compound,and other methods. The organosilieon electronic-pouring sealant had excellent flame-retardant when mass fraction of KH-570 was 0.5% in Al（OH）3,the average particle size of AI（OH）3 was 2.6 Ixm,mass ratio of m（5.0 μm A1203）：m[2.6 μm AI（OH）3] was 160：40,and mass fraction of platinum complex compound was 0.002% in matrix.