中文摘要：

生物电极中微导线的引出质量决定其使用可靠性。建立硅基生物电极铂薄膜和铂铱合金线平行间隙焊过程的有限元模型,研究焊接参数（焊接时间、焊接电流、电极间隙、电极宽度及电极压力）对焊接过程的影响,探讨铂薄膜和铂铱合金线的连接机理。结果表明,对焊接过程影响最大的是电极压力、电极间隙和焊接电流,影响最小的是焊接时间和电极宽度;焊接最高温度集中于电极头之间的微导线上部,铂薄膜和铂铱合金线交界区域温度为600 K以下,远低于其熔点温度,接触处的材料并未熔化产生熔核,只能使周围原子具有一定的扩散能力。因此铂薄膜和铂铱合金的连接形式为无熔核的扩散再结晶连接,即固态键合（Solid state bonding）,从而达到了原子间的结合。

英文摘要：

The extraction quality of microwire of bio-electrodes decides their operational reliability. A finite element analysis model was established for parallel gap welding process of PtIr10 microwire and Pt film on Si substrate of bio-electrodes. The influence of welding parameters-welding time,current,gap,electrode width and force was investigated. Finally,the bonding mechanism of Ptlr10 microwire and Pt film was discussed. The results show that the important influencing factor are force, electrode gap and cun＇ent, while the smallest ones are the welding time and electrode width. The highest temperature is concentrated in the upper region of the wire between the electrode heads, while the temperature at the juncture of Pt film and PtIr10 wire is below 600 K, which is lower than their melting points, so the parallel gap welding wouldn＇t melt the materials at the juncture and it makes the surrounding atoms have a certain ability to spread. Therefore, the connection form is a diffusion recrystallization bonding manner （bonding of state） without nugget and to reach the bonding among atoms.