中文摘要：

采用氮化铝（A1N）和纳米氮化铝（n-A1N）、二氧化硅（SiOz）以及经过硅烷偶联剂（KH560）处理的A1N和Si02与氰酸酯（cE）树脂共混，设计制备了AlN／cE，n-A1N／CE，A1N—SiOz／CE和A1N（KH560）一SiOz（KH560）／CE复合材料。研究了填料的种类、粒径、含量和表面性质对复合材料导热性能、介电性能的影响。结果表明：填料对复合材料的导热性能有显著影响，用n_A1N和A1N混合填充CE，不同粒径的A1N可以形成紧密堆砌而提高热导率A。高含量的A1N添加到CE中会提高复合材料的介电常数，但将SiO：部分取代A1N，能减少介电常数的增加量。

英文摘要：

Three composites based on CE resin, aluminum nitride （AIN）, nano A1N （n-A1N） and sili- con dioxide （SiO2）, and silane coupling agent （KH560） modified A1N and SiO2 ,coded as A1N/CE, n-A1N/CE, A1N-SiO2/CE and A1N（KH560）-SiO2 （KH560）/CE composite, respectively, were pre- pared. The influences of the sort, size and surface nature of fillers on the thermal conductivity and die- lectric properties of composites were investigated in detail. The results show that properties of fillers have great influence on the thermal conductivity of composites. When CE resin was filled by n-A1N and A1N,the resultant composites increased thermal conductivity due to the close arrangement. The composite with a higher content of A1N had higher dielectric constant. But when SiO2 was used to re- place A1N,the increasement of dielectric constant was reduced.