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The thermal residual stress redistribution in a bamboo interconnect
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相关项目:多场作用下薄膜内导线中孔洞扩张和愈合机理的研究
同期刊论文项目
多场作用下薄膜内导线中孔洞扩张和愈合机理的研究
期刊论文 18
同项目期刊论文
The effect of T-stress on crack-inclusion interaction under mode I loading
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Effects of stress and temperature gradients on the evolution of void in metal interconnects driven b
The interaction between a screw dislocation and a plastic zone of an arbitrary shape
Crack and void Healing in Metals
Electromigration-driven motion of an elliptical inclusion
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INTERACTION BETWEEN A SCREW DISLOCATION AND A PLASTIC ZONE OF AN ARBITRARY SHAPE